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IEEE CPMT Thermal Management & Thermo-Mechanical Design Technical Committee

Table of Contents

IEEE Components, Packaging, and Manufacturing Technology (CPMT) Web Page

CPMT Technical Committee

Thermal Management and Thermo-Mechanical Design TC


The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest

  • Electronic Cooling and Thermal Management of Component and System
  • Thermal Design and Analysis
  • Coupled Electro-Thermal Phenomena
  • Thermal and Thermomechanical Measurements
  • Thermal Mismatches and Stressses
  • Temperature Induced Fracture and Moisture Stresses in IC Package
  • Thermomechanical Design and Analysis of Component and System
  • Thermomechanical Computer Aided Design and Engineering

Associated activities:

Links to other societies and events:


For suggestions or comments on TC-9 Web Page, please contact TC-9 Webmaster. To join IEEE/CMPT TC-9, contact TC-9 Chair, Vice Chair, or Webmaster.

Dr. Tony Mak, TC Chair Eastman Kodak Tel: + 585-477-0614 Fax: + 585-588-6023

Professor Gerard Kelly, Europe Vice Chair Dept. of Mechanical and Manufacturing Engineering Cork Institute of Technology Rossa Avenue, Bishopstown Cork, Ireland Tel + 353 21 4326743 Fax + 353 21 4326627

Professor Timothy S. Fisher, U.S. Vice Chair School of Mechanical Engineering Purdue University Birck Nanotechnology Center West Lafayette, IN 47907 USA Tel + 765-494-5627

Professor David B. Go, Webmaster Aerospace and Mechanical Engineering University of Notre Dame 370 Fitzpatrick Hall Notre Dame, IN 46656 USA Tel + 574-631-8394 Fax + 574-631-8341


Anyone can be a participating member of one or more of the CPMT Society’s TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing.

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Last modified on 09 Oct, 2008