Literature Review: Boiling and Evaporative Heat Transfer
Suggested Guidelines
This ‘topic’ page is intended for the consolidation of literature summaries on the title topic. A given paper’s bibliographic information and abstract should be posted. Please provide web links to the journal page or DOI entry wherever possible. Also, brief commentaries after the abstract are welcome.
NOTE: To keep this page in some kind of systematic order, please place entries in reverse chronological order (i.e., most recent first).
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
by Ravi S. Prasher, Journal of Electronic Packaging — September 2003 — Volume 125, Issue 3, pp. 378-385 http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JEPAE4000125000003000378000001&idtype=cvips&gifs=yes
Abstract
This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal designers to model heat pipes and vapor chambers in commercially available conduction modeling tools such as Ansys™ and Icepak™. This modeling scheme allows thermal designers to perform design sensitivity studies in terms of power dissipation of heat pipes and vapor chambers for different scenarios such as configurations, heat sink resistance for a given temperature drop between the heating source and the ambient. This paper also discusses how thermal designers can specify requirements to heat pipe/vapor chamber suppliers for their thermal design, without delving into the complete thermo-fluidic modeling of this technology.
Commentary
This paper provides a nice overview of heat pipe operation and derives models of thermal performance using very simple assumptions that are at least applicable in certain limits. Expressions for various resistances within a heat pipe are identified, and a qualitative optimization is proposed that balances a wick’s thermal resistance with its ability to carry liquid at a sufficient rate. These relations should provide general guidelines for wick design and optimization.